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Quality Inspection & Metrology

Full in-house metrology capability: CMM dimensional inspection, AFM/profilometer surface analysis, helium leak testing, ICP-OES purity verification, and ISO 9001-documented quality records.

Quality Inspection & Metrology

Every Tuguan Semiconductor component leaves our facility with documented, traceable quality records. Our in-house metrology laboratory covers dimensional inspection, surface characterization, purity verification, and functional testing �?eliminating dependency on third-party testing laboratories for most routine quality requirements.


Dimensional Inspection

Coordinate Measuring Machine (CMM)

CapabilitySpecification
Volumetric accuracy±0.001 mm (MPEE)
Repeatability±0.0005 mm
Measuring range600 × 700 × 500 mm
Touch probe1 mm ruby sphere
Scanning modeYes (surface form)
Report formatPDF + DXF comparison overlay

CMM inspection is performed on all precision components with tolerances �?±0.05 mm. A full dimensional report tracing every measured feature to the customer drawing is provided as standard.


Optical & Laser Measurement

For large, thin, or delicate parts where CMM contact could cause breakage:

InstrumentParameterResolution
Laser micrometerOD, wall thickness0.001 mm
Optical comparator (30×)Profile, angles, radii0.01 mm
Digital height gaugeStep heights, parallelism0.001 mm

Surface Metrology

White-Light Interferometer

ParameterSpecification
Vertical resolution0.1 nm
Lateral resolution0.4 μm
Measurement areaUp to 10 × 10 mm per field
StitchingYes �?up to 200 × 200 mm
OutputRa, Rq, flatness map, 3D surface topography

Used for: Optical surface verification (λ/4, λ/10 flatness), CMP-polished surfaces, weld seam flatness.


Contact Profilometer

ParameterSpecification
Vertical resolution0.01 nm
Stylus force0.02�? mN (selectable)
Scan lengthUp to 100 mm
OutputRa, Rq, Rz, Rmax, Rsm; full roughness profile

Used for: Production Ra verification on ground and lapped surfaces; compliance with drawing Ra call-outs.


Atomic Force Microscope (AFM)

ParameterSpecification
Vertical resolution0.01 nm RMS
Scan area100 × 100 μm standard
ModeTapping mode (non-destructive)
OutputRMS roughness, 3D nanoscale map

Used for: Optical polishing verification (Ra < 0.5 nm), subsurface damage studies, bonding surface qualification.


Leak Testing

Helium Mass Spectrometer Leak Tester

ParameterSpecification
Sensitivity1×10⁻¹⁰ mbar·L/s (MLD)
Standard pass criterion< 1×10⁻⁹ mbar·L/s
High-integrity pass criterion< 1×10⁻¹⁰ mbar·L/s (on request)
MethodHelium hood or vacuum chamber
Applicable componentsWelded vessels, closed cavities, vacuum-rated assemblies

100% leak testing is performed on all fusion-welded quartz assemblies used in vacuum or gas-handling applications.


Material Purity Verification

ICP-OES (Inductively Coupled Plasma Optical Emission Spectrometry)

ParameterSpecification
AnalytesNa, K, Li, Ca, Mg, Fe, Cr, Ni, Cu, Al, B, and 20+ trace metals
Detection limit< 1 ppb (element-dependent)
Sample preparationAcid dissolution or surface leach
Turnaround1�? working days

Purity certificates with full ICP-OES data are provided as standard for synthetic fused silica Grade 2 components and on request for all other materials.


Crystal & Optical Characterization

X-Ray Diffraction (XRD) �?Crystal Orientation

ParameterSpecification
Crystal orientation accuracy±0.1° (standard) / ±0.5° (production)
Applicable materialsSapphire, single-crystal materials
MethodLaue back-reflection or rocking curve
ReportOrientation map + deviation from nominal

XRD orientation verification is standard on all sapphire components with specified crystal orientation.


Polariscope �?Birefringence Measurement

ParameterSpecification
Sensitivity1 nm/cm retardation
Measurement range0�?00 nm/cm
Applicable materialsTransparent quartz and fused silica
Standard criterion< 10 nm/cm (< 5 nm/cm optical grade)

UV-VIS-NIR Transmission Measurement

Optical transmission verification from 190 nm to 2500 nm using a calibrated spectrophotometer. Provided for optical-grade windows, viewports, and laser optics on request.


Quality Management System

Tuguan Semiconductor operates under ISO 9001 quality management:

ElementDetails
QMS StandardISO 9001:2015
CalibrationAll instruments calibrated traceable to NIST/NIM national standards
Non-conformanceDocumented NCR system; root cause + corrective action
First Article InspectionFull FAI report on new part numbers (optional PPAP format)
Lot traceabilityHeat number + material cert + inspection records linked to each shipment

Standard documents shipped with every order:

  • Material certificate (purity data)
  • Dimensional inspection report (CMM printout)
  • Surface roughness report (Ra measurement)
  • Certificate of Conformance (ISO 9001)

Optional documents (request at order placement):

  • Birefringence test report
  • He leak test certificate
  • XRD crystal orientation report
  • ICP-OES trace metal analysis
  • Optical transmission test report

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