By Semiconductor Process
Etching — Wet, Dry & Plasma
Plasma-resistant quartz and ceramic components for etching chambers. Tight dimensional tolerances ensure uniform plasma distribution and consistent etch profiles.
Components for Etching — Wet, Dry & Plasma
Focus Ring (Quartz / Ceramic)
Ø 200–450 mm · ±0.02 mm
Quartz Chamber Liner
Custom ID/OD · precision bore
Quartz Showerhead
Multi-hole pattern · position accuracy ±0.05 mm
Quartz Wafer Support / Tray
Flat ±0.01 mm · surface Ra < 0.4 μm