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Precision Cutting & Slicing
Diamond wire saw and precision dicing for fused quartz, sapphire, and ceramics — slice thickness from 0.3 mm with ±0.02 mm tolerance and minimal kerf loss.
Precision Cutting & Slicing
Cutting fused quartz, sapphire, and technical ceramics into precise blanks, wafers, and plates is the first step in any machining workflow. The cutting method, blade specification, and feed rate critically determine the subsequent grinding workload and the risk of subsurface damage. Tuguan Semiconductor operates multiple cutting platforms matched to the material and geometry requirements of each job.
Cutting Methods
Diamond Wire Saw (Multi-Wire)
Multi-wire diamond wire saws simultaneously cut a billet into dozens of slices in a single pass — the most efficient method for high-volume slicing.
| Specification | Value |
|---|---|
| Wire diameter | 0.12–0.35 mm diamond wire |
| Kerf width | 0.15–0.4 mm |
| Slice thickness tolerance | ±0.02 mm |
| Surface roughness (as-cut) | Ra 0.8–1.6 μm |
| Max billet diameter | 500 mm |
| Bow / warp | < 20 μm per 100 mm diameter |
| Parallelism | < 0.03 mm |
Best suited for: High-volume production of wafer-format blanks, optical substrate slices, and window blanks from round or rectangular billets.
Single-Wire Diamond Saw
Single-wire sawing provides greater flexibility for prototype quantities, odd geometries, and very thick sections where multi-wire setup cost is not justified.
| Specification | Value |
|---|---|
| Thickness range | 0.3 mm – 100 mm |
| Thickness tolerance | ±0.02 mm |
| Max billet size | 400 × 400 × 800 mm |
| Kerf width | 0.20–0.40 mm |
| Setup time | < 30 min (no wire change) |
Precision Dicing (Blade Saw)
For small parts requiring very tight positional accuracy of the cut face, blade dicing offers excellent cut quality and CNC-controlled kerf placement.
| Specification | Value |
|---|---|
| Min slice thickness | 0.3 mm |
| Kerf positional accuracy | ±0.02 mm |
| Surface roughness | Ra 0.4–0.8 μm |
| Max part size | 200 × 200 mm |
| Blade specification | Resin-bond diamond, 100–400 grit |
Best suited for: Precision windows, substrates, and small blanks from valuable material where kerf loss must be minimized.
Inner-Diameter (ID) Blade Saw
ID sawing uses a tensioned annular blade and is preferred for cutting single, precise slices from small-diameter rods and billets where setup flexibility is required.
| Specification | Value |
|---|---|
| Max billet OD | 120 mm |
| Min slice thickness | 0.5 mm |
| Thickness tolerance | ±0.03 mm |
| Blade kerf width | 0.25–0.40 mm |
Material-Specific Cutting Parameters
| Material | Preferred Method | Wire/Blade Speed | Feed Rate | Notes |
|---|---|---|---|---|
| Fused quartz | Multi-wire or blade | 15–25 m/s | 0.5–2 mm/min | Low hardness; fast feed acceptable |
| Synthetic fused silica | Multi-wire or blade | 15–25 m/s | 0.5–2 mm/min | Same as natural quartz |
| Sapphire | Single-wire, fine grit | 8–15 m/s | 0.1–0.5 mm/min | Hard; slow feed to avoid wire breakage |
| Alumina 99.5% | Multi-wire or blade | 12–20 m/s | 0.5–1.5 mm/min | Medium hardness |
| Silicon nitride | Multi-wire + US assist | 10–15 m/s | 0.3–0.8 mm/min | Tough; requires coolant flush |
| Silicon carbide | Blade or single-wire | 8–12 m/s | 0.2–0.5 mm/min | Hardest; risk of wire wear |
| Boron nitride | Blade saw | 15–20 m/s | 1–3 mm/min | Soft; rapid cutting |
Subsurface Damage Management
Every cutting method introduces a subsurface damage (SSD) layer — micro-cracks beneath the cut surface that must be removed by subsequent grinding and polishing. Minimizing SSD depth reduces total downstream machining allowance and cycle time.
| Cutting Method | Typical SSD Depth | Required Grinding Allowance |
|---|---|---|
| Multi-wire saw (fine wire) | 15–25 μm | 50–80 μm per side |
| Blade dicing (fine grit) | 10–20 μm | 40–60 μm per side |
| ID blade saw | 20–30 μm | 60–100 μm per side |
| Single-wire (coarse) | 30–50 μm | 80–150 μm per side |
Coolant & Contamination Control
All cutting operations use ultra-pure DI water coolant. No cutting oils or wax-based slurry mounts are used for semiconductor-grade components — eliminating hydrocarbon contamination that would require solvent cleaning. Parts are ultrasonically cleaned and DI-water rinsed immediately after cutting.
Typical Applications
- Optical window blanks — sliced from boules or rods to customer thickness specification
- Wafer carrier plate sections — cut from large-format ceramic plates
- Substrate blanks — sapphire sliced for downstream lapping and polishing
- Quartz tube sections — precise length cuts from drawn tubing
- Ring and disc blanks — cross-sections from quartz rod stock