Ceramic Wafer Carrier & Boat

Ceramic Wafer Carriers & Boats

Ceramic wafer carriers provide an alternative to quartz boats in applications requiring:

• Higher temperatures (> 1200°C) beyond quartz’s continuous use limit
• Superior wear resistance — alumina and SiC resist abrasion from wafer handling
• Thermal shock resistance — silicon carbide carriers for rapid thermal cycling
• Chemical compatibility — where quartz would contaminate the process with SiO₂

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Material Selection Guide

Requirement	Al₂O₃ 99.5%	Al₂O₃ 99.9%	RB-SiC
Max temperature	1600°C	1700°C	1380°C
Thermal shock	Moderate	Moderate	Excellent
Wear resistance	High	High	Very High
SiO₂ contamination risk	None	None	None
Al contamination risk	Low (< ppm)	Very low (< ppb)	None
Thermal conductivity	28 W/(m·K)	35 W/(m·K)	110 W/(m·K)
Best process	Diffusion, oxidation	Ultra-high-purity process	RTP, rapid cycling

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Product Types

Horizontal Alumina Boat

Direct replacement for quartz wafer boats in furnace systems requiring temperatures above 1200°C or where SiO₂ contamination is unacceptable.

Wafer Size	Slots	Slot Pitch	Overall Size	Material
4”	25	4.76 mm	130 × 130 mm	Al₂O₃ 99.5%
6”	25	6.35 mm	175 × 180 mm	Al₂O₃ 99.5%
8”	25	7.62 mm	215 × 230 mm	Al₂O₃ 99.5% or 99.9%
12”	25	9.52 mm	265 × 335 mm	Al₂O₃ 99.9%

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SiC Susceptor / Carrier Plate

Flat SiC plate for single-wafer or small-batch RTP systems. High thermal conductivity provides excellent temperature uniformity.

Parameter	Value
Flatness	< 0.1 mm
Surface roughness (wafer contact side)	Ra 0.4–0.8 μm
Dimensional tolerance	±0.1 mm
Max temperature	1380°C (RB-SiC) / 1650°C (sintered SiC)
Thermal uniformity	ΔT < 5°C across wafer (at 1000°C)

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Machining Precision

All ceramic carriers are machined with diamond tooling:

Feature	Alumina Tolerance	SiC Tolerance
Slot width	±0.05 mm	±0.05 mm
Slot pitch	±0.1 mm	±0.1 mm
Overall dimensions	±0.1 mm	±0.1 mm
Surface roughness	Ra 0.4–1.6 μm	Ra 0.4–1.6 μm
Flatness (carrier base)	< 0.1 mm	< 0.1 mm