Fertigungskapazitäten

CNC Precision Machining

Five-axis CNC grinding and milling centers delivering ±0.01 mm dimensional tolerance and Ra 0.1 μm surface finish on quartz, sapphire, and advanced ceramics.

CNC Precision Machining of Quartz & Ceramics

Precision machining of brittle non-metallic materials — fused quartz, sapphire, and technical ceramics — requires fundamentally different strategies from metal machining. Material brittleness, thermal sensitivity, and chemical reactivity to conventional coolants all demand specialized equipment, tooling, and process parameters.

At Tuguan Semiconductor, CNC precision machining is our core competency. Our grinding centers operate exclusively with diamond abrasive wheels and ultra-pure coolant systems designed to prevent contamination of precision quartz and ceramic workpieces.


Process Capabilities

Cylindrical Grinding (OD & ID)

External diameter (OD) and internal bore (ID) grinding is performed on our CNC cylindrical grinding machines equipped with diamond wheels.

SpecificationStandardPremium
OD tolerance±0.02 mm±0.01 mm
ID tolerance±0.03 mm±0.02 mm
Roundness±0.01 mm±0.005 mm
Surface roughnessRa 0.4 μmRa 0.1 μm
Max OD400 mm300 mm
Max length2000 mm1500 mm

Surface Grinding & Lapping

Flat-surface grinding uses diamond cup wheels or segments; critical flatness is achieved by multi-pass lapping.

SpecificationValue
Flatness< 0.005 mm (grinding) / < 0.002 mm (lapping)
Parallelism (opposite faces)< 0.003 mm
Surface roughnessRa 0.4 μm (grinding) / Ra 0.1 μm (lapping)
Max plate size500 × 500 mm

Profile Grinding (Contour & Radius)

Five-axis CNC grinding allows complex profiles, chamfers, radii, and tapers to be generated in a single setup — minimizing repositioning error.

FeatureCapability
Profile radius (convex/concave)Down to R 1 mm
Angular features±0.1°
Complex contour accuracy±0.02 mm

Why Diamond Tooling Only?

Quartz glass (hardness ~600 HV) and technical ceramics (hardness 1000–2700 HV) are 2–5× harder than hardened steel. Conventional abrasive wheels (corundum, silicon carbide) wear rapidly and risk contaminating the workpiece with abrasive particles. Diamond wheels provide:

  • Long tool life — 10–20× longer than conventional abrasives on quartz
  • Controlled chip formation — smaller chips reduce subsurface damage
  • Consistent surface finish — predictable Ra throughout the wheel’s life
  • Zero metallic contamination — no iron oxide from steel-bond wheels

Cleanroom-Compatible Machining

All CNC machining of semiconductor-grade components is performed with:

  • Ultra-pure DI-water coolant — no cutting oils that would leave hydrocarbon residues
  • Dedicated quartz-only machines — no cross-contamination from ceramic or metal jobs
  • Enclosed machining cells — positive-pressure filtered air prevents airborne particle contamination

After machining, parts undergo ultrasonic cleaning, DI water rinsing, and IPA wipe-down in our ISO Class 7 cleanroom.


Supported Materials

MaterialMachinabilityKey Tooling Requirement
Natural fused quartz★★★★☆Resin-bond diamond wheels
Synthetic fused silica★★★★☆Resin-bond diamond wheels
Sapphire★★★☆☆Metal-bond diamond, fine grit
Alumina (99.5%)★★★☆☆Resin/metal bond diamond
Silicon nitride★★★☆☆Metal-bond diamond
Silicon carbide★★☆☆☆Metal-bond diamond, coarse pre-grind
Boron nitride★★★★★Carbide or HSS tooling acceptable

Typical Lead Times

Order TypeLead Time
Standard stock material, simple geometry5–7 working days
Custom from drawing, moderate complexity10–15 working days
Complex multi-step, tight tolerance15–25 working days
Rush order (subject to availability)Contact us

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